发明名称 SEMICONDUCTOR INTEGRATED CIRCUIT
摘要 <p>PURPOSE:To realize a highly reliable circuit having a stable high speed operating characteristic by arranging a low level processing circuit inside of an integrated circuit chip, and adjusting the characteristic impedance inside of the chip so as to match with a prescribed value. CONSTITUTION:A low level processing circuit 4 is connected to a wire line 6, an inputted external power supply voltage VDD is subject to low level processing up to a level VB required for an internal circuit 2 by the low level processing circuit 4 employing resistance division, and a clock signal inputted through the wire line 6 whose impedance is in matching with 50ohms from a 2nd bonding pad 5 connecting to a clock generator is inputted to the internal circuit 2 at the level of VB. The low level processing circuit 4 is a resistance division circuit comprising a 1st resistor RA connecting to an external power supply via a 1st bonding pad 3 and a 2nd resistor RB connecting to a ground level via a 3rd bonding pad 7, and all the resistors are made up of thin film resistors.</p>
申请公布号 JPH03283913(A) 申请公布日期 1991.12.13
申请号 JP19900084376 申请日期 1990.03.30
申请人 TOSHIBA CORP 发明人 ISHIDA KENJI;WAKIMOTO KEIJI
分类号 H01L21/822;H01L21/338;H01L27/04;H01L29/812;H03K3/356;H03K3/3562;H03K19/0175 主分类号 H01L21/822
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