| 摘要 |
<p>PURPOSE:To obtain a highly accurate plating pattern, by a method wherein patterning is applied after depositing a thin conductor layer on an insulating substrate through metallic layers and a plated metallic layer is formed on the conductor layer. CONSTITUTION:A positive type resist 5 is provided on metallic layers formed by consecutively depositing the first metallic layer 2 formed as a resistor, the second metallic layer 3 to obtain close contact, and the third Au layer 4 on an insulating substrate 1. Patterning is applied to the third and the second metallic layers by using the resist 5 as a mask. With exposure development applied by adhering a negative type resist 7 on the first metallic layer 2 and the resist 5, only the resist 7 on the metallic layer 2 is left to expose Au layers 4. Plating 8 is applied on the Au layers 4. A desired gold plated conductor circuit can be obtained by removing the resist 7 and the exposed metallic layer 2. This method forms a plating pattern of high accuracy.</p> |
