| 摘要 |
Ground connection between an electromagnetic wave shielding layer 6 and a printed circuit 2 formed on a printed circuit board 7 is effected via apertures in a plurality of insulating layers 3a-3c formed between the shielding layer 6 and the printed circuit 2. The apertures in the insulating layers 3a-3c increase in diameter from the printed circuit 2 to the shielding layer 6 so as to improve the connection. <IMAGE> |
