| 摘要 |
PURPOSE:To prevent floating of a chip carrier due to adhesive by externally escaping adhesive poured between a board and a first surface from the adhered surface along a bay. CONSTITUTION:After paste or solder for adhering a chip carrier 1 to a printed circuit board 6 is applied to a region 10 to be adhered with a printed circuit board 6 in an adherable state, the carrier 1 is pressed to the board 6. In the case of pressing, paste, etc., between the bottom 2 of the carrier 1 and the region 10 of the board 6 is fed into a groove 5 in response to the pressing, escaped from cut ports 5a, 5b. Even if the carrier 1 is inserted fixedly into a narrow region, the bottom 2 of the carrier 1 is brought into contact with the region 10, and not floated. |
