| 摘要 |
PURPOSE:To protect a semiconductor device against filling failure by a method wherein the surface of a heat dissipating plate is subjected to an insulating treatment excluding a semiconductor device mounting part, and through-holes are provided to the part which has been subjected to an insulating treatment. CONSTITUTION:The leads 2 of a lead frame are placed on the upside of a heat dissipating plate and pasted through an adhesive agent, a double-sided adhesive tape, or the like. Then, a semiconductor device 1 is stuck onto a semiconductor device mounting pad 11 and fixed, and the electrodes of the semiconductor device 1 are connected to the correspondent inner leads 2 with wires 3 respectively, which is sealed up with thermoplastic resin or the like to form a package 5. Lastly, the lead frame is cut off outside the package 5, and outer leads 2a are formed through a former. At the sealing of a semiconductor device with resin or the like, resin or the like is improved in fluidity through the through-holes 12 provided to the heat dissipating plate 10, the adhesion of resin to the heat dissipating plate 10 is enhanced, and a communicating path between an upper and a lower packaging mold is enhanced in area, so that the defective filling of resin is prevented from occurring and a package can be improved in mechanical strength. |
