| 摘要 |
The present invention provides a semiconductor device formed in a semiconductor chip (20), comprising a circuit layer, a plurality of electrode pads (22) formed on either the upper surface or lower surface of the semiconductor chip and connected to the circuit layer, and a plurality of probe pads (24) formed in combination with and connected to the electrode pads, respectively. In inspecting the semiconductor device, probes (25) of an automatic wafer probe are brought into contact with the probe pads, respectively, so that the circuit layer underlying the electrode pads are not strained or fissured to make the semiconductor device faulty, and the surfaces of the electrode pads to be connected to leads (27) of a lead frame or terminals of a circuit are not damaged. Thus, a normal semiconductor device is not damaged in the inspection process, mounting a faulty semiconductor device on a lead frame is obviated, and the imperfect connection of the semiconductor device to the leads of the lead frame attributable to damages formed in the surfaces of the electrode pads with the probes can be prevented. <IMAGE> |
