| 摘要 |
<p>PURPOSE:To enable chip-like electronic components to be densely mounted on the small area of a multilayered board and to be lessened in packaging height by a method wherein the stacked chip-like electronic components are mounted in a through-hole provided to the multilayered board by insertion. CONSTITUTION:Chip-like electronic components 16 and 17 are inserted into through-holes 11a, 12a, 13a, 14a, and 15a overlapping each other to be mounted. That is, the through-holes 11a, 12a, and 13a which are larger than the electronic component 16 located at a lower side and enable the component 17 to be inserted are provided to boards 11-13 respectively. The through-hole 14a and 15a which are smaller than the through-holes 11a, 12a, and 13a and enables the component 17 to be inserted are provided to boards 14 and 15 respectively. Furthermore, the electronic component 16 is cut off together with a frame lead 2 from a film carrier 1, inserted into the lower part of a component arranging hole 18, and outer lead-bonded to a conductor pattern 20 formed on the upside of the board 14 by soldering.</p> |
