| 摘要 |
PURPOSE:To sharply enhance the adhesion of a wiring conductor to a circuit conductor by a method wherein an intermediate metal layer whose main component is an alloy of an element selected from nickel and cobalt, an element selected from tungsten and molybdenum, and boron is provided to the contact area between the wiring conductor and the circuit conductor. CONSTITUTION:An intermediate metal layer 3 whose main component is an alloy of, at least, an element selected from nickel and cobalt, at least an element selected from tungsten and molybdenum, and boron is formed coating the exposed outer face of a wiring conductor 2 where a circuit wiring 4 is deposited, where the metal layer 3 is formed through an electroplating method, an electroless plating method, or the like. The intermediate metal layer 3 is formed of an alloy of, at least, an element selected from nickel or cobalt, at least an element selected from tungsten or molybdenum, and boron, where the alloy concerned is excellent in wettability to both the wiring conductor 2 and the circuit conductor 4, and when the circuit conductor 4 is deposited on the wiring conductor 2, they come completely into close contact with each other and electrical conduction between them is extremely excellent. |
