HEAT RESISTANT AND HIGHLY AIRTIGHT SOLDER

摘要

PURPOSE:To form the finer structure of the solder at the time of solidification by constituting the solder of the coated particulate matter with the core of a different metal coated with a coating layer of a metal constituting the base particulate matter and the base particulate matter of a solder blank metal. CONSTITUTION:The heat resistant and highly airtight solder is constituted of the base particulate matter 7 consisting of the metal or alloy which is the blank material of the solder 6 and the coated particulate matter 10 with the core 8 which consists of the metal or alloy different from this metal or alloy coated with the coating layer 9 of the metal or alloy constituting the base particulate matter. The solder is constituted of the base particulate matter of the Pb-Sn solder and the coated particulate matter with the core consisting of the Ni or Ni-based alloy coated with the Sn or Pb-Sn alloy. The generation of the cracks by the thermal stresses of the part to be joined and the solder base is prevented in this way.