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发明名称
ADHESION OF WAFER AND DEVICE THEREFOR
摘要
申请公布号
JPH03280525(A)
申请公布日期
1991.12.11
申请号
JP19900081687
申请日期
1990.03.29
申请人
OSAKA TITANIUM CO LTD;KYUSHU ELECTRON METAL CO LTD
发明人
YAMADA NOBUO
分类号
H01L21/02;H01L21/304
主分类号
H01L21/02
代理机构
代理人
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