| 摘要 |
PURPOSE:To facilitate detachment and attachment of a wafer and to polish in high flatness by arranging a ceramic polishing holder, and a vacuum passage for sucking in vacuum the wafer to a water chuck protruding on the upper surface of the holder. CONSTITUTION:Wafer chucks 2 of predetermined number are secured on the upper surface of a ceramic disclike holder 1, and a vacuum passage 3 opened at the upper surface of the chuck 2 from the holder 1 is arranged. If a wafer is secured to the holder and separated therefrom, the holder 1 sucks a wafer 4 in a vacuum. Accordingly, it can be facilitated only by turning ON, OFF a vacuum pump, and detaching and attaching works can be simplified. Since the wafer 4 is placed on the chuck 2 protruding on the holder 1, polishing solution can be easily introduced. Since the holder 1 is formed of ceramics, its warpage due to temperature rise at the upper surface side is prevented during polishing to obtain flatness of the surface to be polished. |
