| 摘要 |
PURPOSE:To preferably seal by welding a seam welded sealed semiconductor device formed by seam welding a metal cap on a laminated ceramic package and to airtightly hold the device by forming the profile of the metal cap analogous in shape but smaller in size than the profile of the welding ring. CONSTITUTION:After a welding ring 5 and an external lead 4 are soldered to a laminated ceramic 2, a semiconductor element is associated with a laminate ceramic package formed by plating nickel as primary layer and gold 8 on a mount 7, a bonding part 6, a welding ring 5 and an external lead 4. Then, the throttled part of a metallic cap 3' is engaged with the bore of the ring 5 to perform a seam welding. Since the profile of the welding ring is formed smaller than that of the metallic cap at this time, a gold-nickel alloy is obtained by seam weld sealing, with the result that airtightness is retained, and improper leakage can be remarkably reduced. |
