| 摘要 |
PURPOSE:To obtain a small size and thin over-current limiting type semiconductor device by utilizing a stacked diode chip as a current limiting diode and then securely bonding this diode chip on a conductive layer on the bottom plate. CONSTITUTION:A package is formed by bonding a side frame 20 to a copper bottom plate 1 and then covering the upper portion with a cover 2. An insulating plate 11 is blazed on the bottom plate 1, a transistor chip 4, a collector conductor 5, a base conductor 6, an emitter conductor 7 and a stacked diode chip 9 are fixed on the bottom plate 1 and these elements are mutually connected with an Al wiring 8. A lead collector terminal 51, a base control terminal 61 and an emitter terminal 71 are formed outside the package through the respective conductors 5 to 7. The inside of package is filled with Si resin 13 covering the transistor chip and epoxy resin 14 provided thereon. According to this constitution, the manufacturing processes may be simplified and a small size and thin package can be manufactured. |
