发明名称 DICING OF SEMICONDUCTOR WAFER
摘要 <p>PURPOSE:To pick up a dice by using the fact that ultraviolet irradiation remarkably reduces the adhesive strength of pressure sensitive adhesive which has saturated copolymerized polyester resin, ultraviolet crosslinking acrylic ester and copolymerization starting agent as main ingredients. CONSTITUTION:On a base material sheet which is the copolymer of polyvinyl chloride or vinyl chloride containing plasticizer and transmits ultraviolet, pressure sensitive adhesive component is laminated through a film made of poly-alpha- olefin or polyalkylenterephthalate which does not transmit plasticizer and ultraviolet bridging acrylic ester but transmits ultraviolet and a wafer is bonded for dicing. The main components of the pressure sensitive adhesive are the ultraviolet crosslinking acrylic ester of 15-200 parts weight composed of monomer or oligomer having at least two acryloyl group or metaacryloyl group in a molecule per saturated copolymerized polyester resin 100 parts weight, pressure sensitive adhesive 10-200 parts weight and copolymerization starting agent. The adhesive strength is remarkably reduced by the ultraviolet irradiation from the film back and dice pick up is facilitated.</p>
申请公布号 JPH03278444(A) 申请公布日期 1991.12.10
申请号 JP19900238755 申请日期 1990.09.07
申请人 BANDO CHEM IND LTD 发明人 KURODA HIDEO;TANIGUCHI MASAO
分类号 C09J7/02;H01L21/301;H01L21/78 主分类号 C09J7/02
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