| 摘要 |
PURPOSE:To prevent a short circuit between adjacent conductors when a semiconductor device where long conductors are stretched is sealed by a transfer molding operation by a method wherein at least one part out of a plurality of conductors which connect semiconductor-element electrodes to inner leads of a lead frame is covered, in a bridge shape, with a resin which is different from a sealing resin. CONSTITUTION:A semiconductor device is composed of a semiconductor element 1 mounted on a lead frame 3; a plurality of conductors 5 which connect electrodes 2 of the semiconductor element 1 to inner leads 4 of the lead frame 3; and a sealing resin 8 which molds them integrally. At the semiconductor device, at least one part out of the plurality of conductors 5 is covered, in a bridge shape, with a resin 6 which is different from the sealing resin 8. For example, a thermoplastic-resin sheet frame is supplied onto a plurality of conductors 5 which are stretched, by a wire bonding operation, between electrodes 2 of a semiconductor element 1 and inner leads 4 of a lead frame 3. Then, the thermoplastic-resin sheet frame is heated and melted so as to cover the plurality of conductors; after that, the frame is cooled and hardened; a precoating material 6 is formed. Thence, this assembly is sealed with a resin 8 by a transfer molding operation and is completed. |
