| 摘要 |
<p>A plating solution for plating metal with Au, Pd and Cu contains 3-10 g/l gold, 2-5 g/l palladium, 0.01-0.2 g/l copper, 44-45 g/l sodium sulfide, 80-120 g/l EDTA 2Na, 0.05-1 g/l arsenic or selenium as a glass agent and 0.04-1 ml/l polyethyleneglycol as a wetting agent. This plating solution does not make water pollution because it doesn't contain cyanate.</p> |
