发明名称 POLISHING METHOD AND POLISHING DEVICE
摘要 PURPOSE:To polish the polishing target layer of a member to be polished of laminated structure easily with high accuracy by providing a sample base with mechanism for adjusting either one of the fitting position and fitting attitude of the member to be polished in the preceding process in a polishing process. CONSTITUTION:The adhesive sticking of a member to be polished 3 to a movable jig 1 is performed by heating a sample base to approximately 120 deg.C to adhere the member to be polished 3 after a wax applying process 4, then applying pressure to the member to be polished 3 and cooling it forcibly. The height 2 and inclination thetay of the member to be polished 3 stuck to the movable jig 1 on the sample base are adjusted in an adjusting process 7. This adjustment is performed to make a polishing target layer 3b in the member to be polished 3 horizontal to the specified horizontal face. After terminating the adjusting process 7, planing 8 is performed by a rotary polishing grinder.
申请公布号 JPH03277467(A) 申请公布日期 1991.12.09
申请号 JP19900181394 申请日期 1990.07.11
申请人 HITACHI LTD 发明人 HAJIKI NOBUHIKO;BABA MASAICHI;FURUICHI HIROO;SAKAGUCHI HIROSHI;YAMAMURA SHIGEKI;SATO YOJI
分类号 B24B37/07 主分类号 B24B37/07
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