发明名称 CLEANING APPARATUS FOR MOLD FOR RESIN PACKAGE OF ELEMENT
摘要 PURPOSE:To enhance the molding efficiency by cleaning a mold without stopping a molding machine by detecting the amount of the sealing solid resin bonded to the inner surface of a cavity on the basis of the signal from an image sensor and supplying a dummy lead frame and a cleaning resin to the mold when the amount of the resin becomes a reference amount or more. CONSTITUTION:A control apparatus 12 confirms the distribution of the sealing resin on the inner surface of a cavity 5b on the basis of the signal from an image sensor 11 and gives instructions to a main rack 2, a sub-rack 2a, an insert device 3, a main rack for a resin, a sub-rack 7a for a resin and a resin supply apparatus when the distribution of the sealing resin becomes an extent equal to or more than a predetermined standard to supply a dummy lead frame 1a and a cleaning resin tablet 6a to a mold 5 in place of a lead frame 1 and a sealing resin tablet 6. When the range of the sealing resin becomes the standard or less, the lead frame 1 and the sealing resin tablet 6 are again supplied to perform regular molding. The cavity can be cleaned without stopping a molding machine and molding efficiency can be enhanced.
申请公布号 JPH03277514(A) 申请公布日期 1991.12.09
申请号 JP19900078383 申请日期 1990.03.27
申请人 MITSUBISHI MATERIALS CORP 发明人 OBARA MITSUHIRO;USUI HIROO
分类号 B29C45/02;B29C45/17;B29L31/34 主分类号 B29C45/02
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