| 摘要 |
PURPOSE:To mount in high density by bonding other element together with an IC chip to upper and lower surfaces of a common TAB lead in one lot. CONSTITUTION:A first IC chip 1, a resistor 2 with bumps and a capacitor 3 with bumps are connected to leads 41 through bumps 9, a second IC chip 8 is connected through bumps 9 at its outside, and the chip 1, the resistor 2, the capacitor 3, and the chip 2 are bonded to the upper and lower surfaces of loads 4. In this case, the chip 1, the resistor 2, the capacitor 3 are so bonded to the leads 4 as to be disposed inside from the inner periphery of the region formed with the bumps 9 of the chip 8. Further, the resistor 3 is bonded to leads 4a, 4b, the upper and lower surfaces of TAB leads can be used. If they are finally mounted in a device, a mounting density of about twice as large as conventional one can be performed. |
