PROCESS FOR EXPOSING A PHOTOSENSITIVE RESIN COMPOSITION TO LIGHT

摘要

The present invention provides an improved process by which dissolved oxygen is effectively removed from a photosensitive resin layer of a photosensitive resin plate. The process comprises preliminary exposing to light the photosensitive resin plate to quench oxygen dissolved in said photosensitive resin layer before conducting a main exposure, wherein the photosensitive resin layer is prepared from a photosensitive resin composition which comprises, (a) a polymer binder, (b) a radically polymerizable monomer, (c) a sensitizing dye, and (d) a photopolymerization initiator which is excited by a light of a different wave length from a light exciting the sensitizing dye, the preliminary exposure is conducted with a light only exciting the sensitizing dye and the main exposure is conducted with a light exciting the photopolymerization initiator.