| 摘要 |
A boiler type cooler device for cooling power semiconductors comprise: an evaporator 3 containing aqueous solution of ethylene glycol as the cooling medium; a condenser 5; a vapor pipe 6 and a liquid return pipe 7. According to a first aspect, the lowest bottom of the condenser is at a level higher than the top surface of the cooling medium in the evaporator, the bottom surfaces of the condenser being tilted downward towards the top end of the liquid return pipe. According to another aspect, a pump 25 is provided in the liquid return pipe for driving the cooling medium therein to the evaporator. According to still other aspects, the liquid return pipe is covered with a heat insulating material 32, or a rubber string 34 extends centrally therewithin. A deaeration device for the aqueous solution of ethylene glycol comprises two separate deaeration baths 35, 42 and a mixing bath 49. |
