Mfg. electronic component with chip on thermal conductor - positioned in through-hole in base for use as surface mounted power device on metal core circuit board

摘要

Chip(s) are placed on a base (1) connecting to the terminals leading to the outside and contact a thermal conductor (11). The latter and the base are perforated in the area (13) for mounting the chip (30). A heat conductive piece (21) is placed in the hole (20) and connected to the base and chip is placed on and the a frame (11) and the heat conductor. The frame is pref. of copper alloy or aluminium. The base is perforated by stamping, etching or erosion. The frame and base are connected by pinching, cold welding, bonding with adhesive or soldering. The frame is placed with Ni and/or Ag or Au on the surface (25) fitting in the hole. The chip is attached to the frame by bonding with adhesive, soldering or eutectic bonding and contacted with the terminals (12) with bond wire (32). USE/ADVANTAGE - Power device mountable on surface of metal core circuit boards. Can be pushed through circuit board and soldered firmly to the back. Standard lead frames may be used as the base. Ensures esp. good heat dissipation.