| 摘要 |
PURPOSE:To prevent plating from being peeled during assembling by nongloss or semigloss plating a lead frame, and then allowing the plated part to thermally reflow, thereby flattening the plated surface. CONSTITUTION:A CERDIP 20 is composed by adhering a lead frame 3 made of metal such as 42 alloy between a window frame 1 made of ceramics and a base 2 by low melting point glass 4. After the frame 3 is nongloss or semigloss sheath-plated 10, the plated part 10 is allowed to thermally reflow before assembling steps are started, thereby flattening the surface of the plated part 10. A solid state image sensor is assembled by using the CERDIP 20. In such a case, even if a jig is brought into contact with the surface of the part 10 during assembling of the sensor, a plating material is scarcely peeled. Thus, the quantity of the material adhered on an image sensing chip can be reduced, and the yield of the sensor can be improved.
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