| 摘要 |
<p>A conductive layer (e.g., 21) is formed beneath a runner (e.g., 23) in an integrated circuit. The conductive layer is also formed within vias (e.g., 17). The conductive layer (e.g., 21 ) preserves electrical connection should the runner (e.g., 23) separate due, perhaps, to electromigration or stress voiding. The conductive layer (e.g., 21 ) also provides protection against various failures or defects which may occur in the runner material (e.g., 23) within the vias (e.g., 17). <IMAGE></p> |
