| 摘要 |
<p>PURPOSE:To obtain a case for a hybrid integrated circuit, one surface of which can be mounted on the substrate of an external circuit, by taking out an external terminal in parallel with a metallic base. CONSTITUTION:External terminals 3 are taken out in parallel with a metallic base 2. A circuit part such as a ceramic board can be loaded onto a stem formed by fixing the external terminals 3. Loading parts and the external terminals 3 are connected by metallic small-gage wires 6, and a metallic cap 1 is installed through a method such as welding.</p> |
