| 摘要 |
PURPOSE:To enable a multilayer ceramic circuit substrate with 40 layers or more to be produced by using a green sheet with a specific void volume including a ceramic power and void for further improving adhesion of the green sheet of each layer and preventing an interlayer delamination. CONSTITUTION:A green sheet with its void volume exceeding 50% including a ceramic powder and resin is used. The void volume of the green sheet can be controlled according to composition and drying conditions. Under normal production conditions and natural drying, approximately 40% void volume can be obtained, which should be increased to 50% or higher. The void volume reaching 90% can also easily be adjusted. If the void volume is less than 50%, elongation of the green sheet on lamination is in shortage and it cannot be deformed so that recessed and projecting parts due to wiring pattern cannot be wrapped completely, thus resulting in interlayer delamination. |
