| 摘要 |
<p>An interrupting layer is formed on the surface of a substrate with inorganic fine powders and a surface of the interrupting layer is contacted with gases obtained by exciting raw material gases containing carbon sources gases, followed by the separation of the diamond synthesized from the substrate. The use of the interrupting layer composed of the inorganic fine powders allows ready separation of the diamond from the substrate and the diamond separated is suitable for diaphragms for speakers, heat conductive plates, cutting tools, semiconductors, etc. by appropriately choosing shapes of the substrate. Further, the resulting diamond film is pulverized, thereby yielding diamond powders which are useful for abrasive tools, cutting tools, etc. <IMAGE></p> |
