| 摘要 |
PURPOSE:To detect the chipping of a component automatically by utilizing the fact that reflected light at a chipping shoulder part is weaker than reflected light at an unelipped shoulder part and deciding a chip component as a defective when the differ ence in intensity from reflected light beams from a couple of shoulder parts is larger than a specific value. CONSTITUTION:The chip component 100 is conveyed along a conveyance path 200 in sequence and its shoulder parts 110R and 110L are irradiated with spot light beams SLR and SLL from irradiation parts 10R and 10L. Reflected light beams RLR and RLL from the shoulder parts 110R and 110L are photodetected 22R and 22L and photodetecting elements 22R and 22L send signals corresponding to the respective intensity values as voltages to a comparison to the respective intensity values as voltages to a comparison part 30. At this time, the voltage V1 outputted by the element 22R of the photodetection part 20R is lower than the voltage V2 outputted by the element 22L of the photodetection part 20L. Further, a voltage (V2 - V1) is inputted to the comparator 34 of the comparison part 30. Further, the chipping exceeds the permissible limit, so the voltage (V2 - V1) exceeds the specific value and the compara tor 34 outputs a defective signal 31 to reject the defective chip component from the conveyance path 200. |
