发明名称 |
INTEGRATED CIRCUIT CHIP CARRIER |
摘要 |
A chip carrier includes a body (1) having a central region and sidewalls (31) connected to the central region by an elastically deformable region (33), in order to reduce thermal strains. Also for the same reason a heat sink (41) may be attached underneath the carrier below the carrier's die attachment site (8) and thermally conductive material (40,42) may connect them together. The heat sink may be used for mechanical anchorage. The chip carrier may be produced by injection moulding from an aromatic thermoplastic polymer. A carrier may be moulded with more than one die attachment site or a circuit board with die attachment sites could be moulded, preferably with the die attachment site recessed so that the surface of the die 9 is co-planar with conductive tracks on the board. |
申请公布号 |
IE56754(B1) |
申请公布日期 |
1991.12.04 |
申请号 |
IE19850001233 |
申请日期 |
1985.05.17 |
申请人 |
BRITISH TELECOMMUNICATIONS PUBLIC LIMITED COMPANY |
发明人 |
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分类号 |
H01L23/12;H01L23/057;H01L23/13;H01L23/14;H01L23/367;H01L23/498;H01L23/538;H05K1/02;H05K3/00;H05K3/24;H05K3/34;H05K3/40;H05K3/42 |
主分类号 |
H01L23/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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