| 摘要 |
<p>PURPOSE:To prevent the falling-off of a substrate at the time of service interruption and at the time of sensor trouble and the insufficient flatness of the substrate by providing a falling-off preventive means for obviating the falling-off of the substrate. CONSTITUTION:When a wafer 30 is extracted from a wafer carrier 20, the height of the wafer carrier 20 is adjusted so that a suction arm 13 is positioned on the side slightly lower than the wafer to be extracted 30. A wafer hand 10 is moved from the right direction to the left direction until a front end enters under the wafer 30 in the suction arm 13 under the state in which falling-off preventive arms 11, 12 are opened as shown in the figure. The suction arm 13 is elevated slightly and the wafer 30 is picked up from the wafer carrier 20, the wafer 30 is sucked and held under a vacuum, the wafer hand 10 is shifted in the right direction up to a position shown in A, and the falling-off preventive arms 11, 12 are closed.</p> |
