| 摘要 |
PURPOSE:To enable a low permittivity to be maintained using fluorine plastic layer and obtain a multilayer printed-wiring board with further reduced dimensions change rate by allowing the fluorine plastic layer as an adhesive for joining a resin-impregnated fiber material and a metal layer or an inner layer material and the metal layer to be reinforced by a fiber base. CONSTITUTION:Metal layers 4 and 6 are joined in one place by an inner layer material which is obtained by joining metal layers 4 and 6 through low melt- point fluorine plastic layers 3 and 5 reinforced by a fiber base on both surfaces of a polytetrafluoroethylene impregnated fiber material 1 or on both surfaces of two or more fiber materials 1 which are joined by the polytetrafluoroethylene layer. Concrete examples of the polytetrafluoroethylene(PTEE) impregnated fiber material 1 to be used are inorganic fiber including glass one, woven cloth and nonwoven cloth of organic fiber including aromatic polyimide one and fiber material including paper which are impregnated with PTFE. |
