发明名称 Laser machining apparatus and method of the same.
摘要 <p>A laser machining apparatus includes a laser beam source (1), such as of excimer laser, which produces a laser beam to be projected on a work piece or a sample (13), first and second illumination light sources (16, 17) which have wavelengths substantially equal to the wavelength of the laser beam and illuminate the entire image and the laser beam, respectively, a first beam splitter (17) which guides the image produced by the illumination light to an observation unit, a second beam splitter (10) which guides the laser beam from the laser beam source to an objective lens, and a controller which controls the machining condition including the relative positioning between the sample and the laser beam depending on the result of observation. The laser beam guide path structure from the laser beam source to the sample has its interior wall (63) made of laser-transparent material such as glass, and the transparent material is enclosed by a laser blocking material (67, 68) such as a metal or water. &lt;IMAGE&gt;</p>
申请公布号 EP0459394(A2) 申请公布日期 1991.12.04
申请号 EP19910108687 申请日期 1991.05.28
申请人 HITACHI, LTD. 发明人 MIYAUCHI, TATEOKI;MARUYAMA, SHIGENOBU;MIZUKOSHI, KATSUROU;HONGO, MIKIO;MORITA, KOYO;KATAYAMA, KAORU;SUZUKI, MINORU;MERA, KAZUO;SAKAMOTO, HARUHISA
分类号 B23K26/03 主分类号 B23K26/03
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