发明名称 |
Process of making a ferroelectric electronic component and product |
摘要 |
An improved process of making a ferroelectric electronic component, such as a non-volatile RAM or an electro-optic switching array, is disclosed. The process essentially includes the separate formation of two subassemblies and then connecting them by placing one on top of the other. Electrical contacts are made by "bumping" or other "flip chip" techniques.
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申请公布号 |
US5070026(A) |
申请公布日期 |
1991.12.03 |
申请号 |
US19890371548 |
申请日期 |
1989.06.26 |
申请人 |
SPIRE CORPORATION |
发明人 |
GREENWALD, ANTON C.;BUCHANAN, BOBBY L. |
分类号 |
H01L27/115 |
主分类号 |
H01L27/115 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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