发明名称 METHOD FOR ETCHING DIAMOND THIN FILM
摘要 PURPOSE:To enhance the etching rate of a diamond thin film and remarkably improve etching productivity by irradiating the aforementioned thin film with electron beams and simultaneously bringing the resultant plasmatic gas produced with the above-mentioned electron beams into contact with the aforementioned thin film. CONSTITUTION:A diamond thin film 4 is provided in close contact with a substrate 3 thereon and arranged in a reaction chamber 1. A voltage is applied across electrodes 2 and 5 in an atmosphere containing O2 or/and H2. The thin film 4 is then irradiated with electron beams produced by DC discharge. Thereby, the atmospheric gas is converted into a plasma with the above-mentioned electron beams and brought into contact also with the aforementioned irradiating part to etch the thin film 4. The relation between the temperature of the substrate 3 and the amount of etching (decrement of film thickness of the thin film 4) is as shown in the figure in carrying out the etching by changing the above-mentioned temperature of the substrate 3 with a heater 19 for heating the substrate. That is the amount of etching is increased with increasing substrate temperature.
申请公布号 JPH03271200(A) 申请公布日期 1991.12.03
申请号 JP19900071672 申请日期 1990.03.19
申请人 KOBE STEEL LTD 发明人 MIYAUCHI SHIGEAKI;MIYATA KOICHI;KUMAGAI KAZUO;KOBASHI KOJI
分类号 C30B33/12;C30B29/04;C30B33/00;H01L21/302;H01L21/3065 主分类号 C30B33/12
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