发明名称 |
METHOD FOR ETCHING DIAMOND THIN FILM |
摘要 |
PURPOSE:To enhance the etching rate of a diamond thin film and remarkably improve etching productivity by irradiating the aforementioned thin film with electron beams and simultaneously bringing the resultant plasmatic gas produced with the above-mentioned electron beams into contact with the aforementioned thin film. CONSTITUTION:A diamond thin film 4 is provided in close contact with a substrate 3 thereon and arranged in a reaction chamber 1. A voltage is applied across electrodes 2 and 5 in an atmosphere containing O2 or/and H2. The thin film 4 is then irradiated with electron beams produced by DC discharge. Thereby, the atmospheric gas is converted into a plasma with the above-mentioned electron beams and brought into contact also with the aforementioned irradiating part to etch the thin film 4. The relation between the temperature of the substrate 3 and the amount of etching (decrement of film thickness of the thin film 4) is as shown in the figure in carrying out the etching by changing the above-mentioned temperature of the substrate 3 with a heater 19 for heating the substrate. That is the amount of etching is increased with increasing substrate temperature. |
申请公布号 |
JPH03271200(A) |
申请公布日期 |
1991.12.03 |
申请号 |
JP19900071672 |
申请日期 |
1990.03.19 |
申请人 |
KOBE STEEL LTD |
发明人 |
MIYAUCHI SHIGEAKI;MIYATA KOICHI;KUMAGAI KAZUO;KOBASHI KOJI |
分类号 |
C30B33/12;C30B29/04;C30B33/00;H01L21/302;H01L21/3065 |
主分类号 |
C30B33/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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