| 摘要 |
PURPOSE:To provide a second bonding position close to an electronic component so as to make an electronic circuit device of this design small in size by a method wherein a connection pad to which a conductive chip is fixed is provided to a board so as to connect an electronic circuit provided onto the board of a lead frame to another electronic circuit. CONSTITUTION:An chip-like electronic component 12 such as an IC or the like and a conductive chip 13 formed of a conductive material such as metal or the like which constitute an electronic circuit together with a wiring pattern are provided onto a board 10a of a lead frame through die bonding. Thereafter, when a lead pin 15a of an optical connector, a photodetective element, a light emitting element, or the like is connected to the chip 13 through a bonding wire, a second bonding position on the chip 13 is located high. Therefore, a wire bonding tool 6 and a capillary 7 hardly come into contact with the component 2, so that a second bonding position can be set near to the component 12. By this setup, the board 10a can be made small in size and an electronic circuit device can be miniaturized as a whole.
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