| 摘要 |
<p>PURPOSE:To contrive a reduction in the amount of a fluid by a method wherein a retention body is extensibly and contractibly provided with a grasping body for grasping a semiconductor wafer, which is held by the retention body in a non-contact state by a fluid force, in such a way that the tips of the grasping body are abutted on the peripheral edge part of the wafer and is provided with a means for controlling the amount of the fluid after the wafer is grasped. CONSTITUTION:A retention device is moved over a semiconductor wafer 12 placed on a recessed part 31a of a tray 31 in a state that a grasping body (an arm) 18 is spread outside of the diameter of the body 18. Then, a solenoid ON-OFF valve 17 is opened and when the retention device is made to descend up to a prescribed position while a fluid is flowed out through a blow-off port 15 of a retention main body 11, the wafer 12 is sucked and held by the device in a non-contact state by a fluid force. Then, the retention device is made to ascend, a current is made to flow through electromagnets 22 and when the electromagnets 22 suck magnetic bodies 21 of the grasping body 18, grooves 19a of pawl bodies 19 on the tips of the grasping body 18 are engaged with the peripheral edge part of the wafer 12 and the wafer 12 is grasped by the grasping body. After this, the valve 17 is shut and the outflow of the fluid is stopped. Thereby, the amount of the fluid is reduced and an air current in a clean room can be prevented from being disturbed.</p> |
