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发明名称
COOLING STRUCTURE FOR ELECTRONIC COMPONENT
摘要
申请公布号
JPH03270098(A)
申请公布日期
1991.12.02
申请号
JP19900069131
申请日期
1990.03.19
申请人
FUJITSU LTD
发明人
HIRAKI MOTOMASA
分类号
H05K7/20;H05K1/02;H05K1/18;H05K3/34
主分类号
H05K7/20
代理机构
代理人
主权项
地址
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