| 摘要 |
PURPOSE:To improve mechanical machining accuracy, to stabilize the operation and to enhance the output and the efficiency by subjecting the sliding face of one or both of an ultrasonic oscillator and a resilient body to surface grinding through lapping or ultrasonic machining. CONSTITUTION:Driver 32 for an ultrasonic oscillator 11 is mounted on a lapping machine 62 filled with liquid abrasives 65. When the lapping machine 62 is rotated with holding members 61a, 61b being reciprocated linearly, the surface of the driver 32 to be machined is grinded. Furthermore, the surface to be machined of a rail 34 filled with the liquid abrasive 74 is brought into contact with a machining horn 75 and reciprocated linearly thus oscillating a ultrasonic oscillator 76. Consequently, the abrasives existing between the machining horn 75 and a work is impacted against the work with the oscillating energy exerted from the ultrasonic oscillator 76 and thereby a large impact is exerted on a micro area. According to the invention, grinding work can be carried out with a machining accuracy in the order of micron. |
