| 摘要 |
PURPOSE:To prevent a bump from being stripped off and to prevent a main conductor from being disconnected by a method wherein a metal whose solderability is poor as compared with that of a solderadhesion part is formed around the solder-adhesion part. CONSTITUTION:In order to prevent a solder 17 from coming into contact with a main conductor 8 of Cu, a metal 23 whose solderability is poor as compared with that of a solder-adhesion part is formed around the solder-adhesion part at the outer circumference part of the solder-adhesion part. When the outer circumference part of the solder-adhesion part is surrounded by the metal 23 whose solderability is poor, the solder 17 for bump use does not flow out from the solder-adhesion part. Consequently, the solder does not come into contact with the main conductor 8 and is not alloyed. Thereby, it is possible to prevent a bump from being stripped off and to prevent the main conductor from being disconnected. |
