发明名称 CURABLE RESIN COMPOSITION
摘要 PURPOSE:To obtain a composition, composed of a copolymer of conjugated diene-based polymer blocks and N-substituted maleimide polymer blocks and a thermosetting resin and/or vinyl monomer and excellent in mechanical strength, heat and moisture resistance, electrical characteristics, etc. CONSTITUTION:A curable resin composition obtained by mixing or previously reacting (A) a copolymer, expressed by the formula (X is conjugated diene-based polymer block composed of conjugated diene polymer and/or copolymer of conjugated diene and vinyl monomer; Y is N-substituted maleimide polymer block; n is 1 or 2) and having (20/80)-(90/10) weight ratio of the blocks (X) to (Y) and 500-100000 number-average molecular weight with (B) a thermosetting resin (preferably an epoxy resin, polybutadiene resin, maleimide compound or cyanic acid ester resin) and/or vinyl monomer in amounts so as to provide (90/10)>=A/B>=(10/90) weight ratio.
申请公布号 JPH03269047(A) 申请公布日期 1991.11.29
申请号 JP19900068471 申请日期 1990.03.20
申请人 NIPPON SODA CO LTD 发明人 MURAMOTO HIROO;KIMURA KIMIHARU;MATSUMOTO HITOSHI
分类号 C08L33/14;C08F285/00;C08F287/00;C08G59/00;C08K5/00;C08L33/18;C08L33/24;C08L47/00;C08L53/00;C08L63/00;C08L79/08;C08L101/00 主分类号 C08L33/14
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