| 摘要 |
<p>PURPOSE:To realize a small size in a state that a good characteristic is maintained and to reduce a production process by a method wherein a resistor formed of a thick film if formed on one face of a ceramic multilayer circuit board and individual components are connected by using blind through holes. CONSTITUTION:Resistor R1 to R5 are formed of a thick film on either surface of a ceramic multilayer circuit board 1; in addition, components such as a transistor Tr, a coil L1, a capacitor C2 and the like are mounted; and components such as capacitors C1, C3, C4 and the like as remaining components are mounted on the rear. The components which are mounted on the surface and the rear are connected by using wiring patterns on the surface and the rear and by using blind through holes 2. Thereby, a production process is reduced, and a small size is realized in a state that a good characteristic is always maintained.</p> |
