| 摘要 |
PURPOSE:To completely and surely remove the carbon sticking near a processing part by processing org. matter by using a laser, and then subjecting the part near the processing part to a high-frequency electric discharge in the presence of gaseous oxygen. CONSTITUTION:A substrate, etc., consisting of the org. matter, such as polyimide, are subjected to the processing, such as boring, by using the excimer laser, etc., and are then subjected to the high-frequency electric discharge in the presence of the gaseous oxygen. The black products, i.e., carbon stains sticking around the laser processed part are then completely and surely removed. The high reliability of a wiring board is obtd. if this substrate is applied to a copper polyimide substrate, etc., to be used for electronic devices, packages, etc. |
