| 摘要 |
PURPOSE:To improve the heat dissipating characteristic of a semiconductor device when a plurality of chips are mounted on the same package by directly bonding the chips to a bed or package substrate. CONSTITUTION:Semiconductor chips 41 are directly bonded to a bed 42 in their rears. The wiring between the chips is performed with bonding wires 45 through Cu wiring 44 formed on layers 43 of a highly insulating substance, for example, polyimide. The bed 42 can be made of 42-alloy, Cu, etc., and the bonding between the chips 41 and bed 42 can be made with an insulating bonding agent of polyimide, etc., or a conductive bonding agent. As a result, the thermal resistance between the semiconductor chips 41 and the package surface can be reduced. Therefore, a multi-chip package type semiconductor device which is excellent in heat dissipating effect is obtained. |
