Automated bonding system for IC chip - uses signal conductor paths and earthing plane on opposite sides of dielectric film

摘要

The bonding system uses a dielectric film (102) carrying a number of signal conductor paths (104) on one side (102b) matched to the conductors of an IC supported at the centre of a rectangular frame. The second side (102a) of the dielectric film (102) has an earthing plane (105) coupled to the IC chip via an earthing wire (106), bent at an angle to the earthing plane (105) to bring it into the same plane as the signal conductor paths (104). USE - For digital and HF analogue electronic system.