CIRCUIT BOARD FOR MOUNTING IC AND MOUNTING METHOD THEREOF

摘要

A circuit board for mounting ICs comprises required circuit conductor patterns formed on one side of an insulation layer, bumps for bonding the pads of ICs to them which are connected to required parts of the circuit conductor patterns electrically, penetrate the insulation layer and protruding to the external of the circuit board, and a light transmitting insulation coating layer which can transmit irradiation light for heating and melting the bumps and is formed on the circuit conductor pattern side. There is a basic method of mounting ICs on such a circuit board in which pads of an IC chip are connected electrically with the bumps after heating and melting the bumps by the action of the irradiation light projected concentratedly on the bump parts from the side of the light transmitting insulation coating layer in the state that the IC chip are placed on the bumps.