Assembly of sensor-chip on printed circuit board - obtd. by gluing chip to carrier material, attaching to PCB inside ring shaped barrier and filling by injection moulding

摘要

Assembly prepn. features attaching a semiconductor chip to a carrier with the same or a lower expansion coefft. pref. Si or quartz-glass, and the same or lower material thickness, pref. using a thin lamination foil made of polymerisable material. A cavity is formed on the PCB for the chip-assembly using another thickness of the PCB material by laminating this to the main PCB. This surround is pref. 10-50 micron thinner than the chip and carrier assembly. The chip is mounted inside the ring and sensitive areas covered with a ductile foil, e.g. Al or Cu or temp. resistant polymer. The PCB has holes to allow penetration and locking on of the moulding material. The assembly is placed in the injection moulding machine, with a defined pressure acting on the chip surface, and plastic injected inside the ring.