CONDUCTIVE ADHESIVE SHEET USED IN SEMICONDUCTOR DEVICE MANUFACTURE

摘要

A adhesive sheet is used as a wafer sheet for retaining a semiconductor wafer while grinding or separating into semiconductor chips, and the adhesive sheet comprises a flexible film structure (1) having a conductibility and an adhesive layer (2) coated on one surface of said flexible film structure, wherein the conductive flexible film structure prevents an integrated circuit produced in each semiconductor chip from damages due to static electricity produced between the adhesive sheet and the semiconductor wafer or chips upon peeling off.