| 摘要 |
A dense, sintered ceramic material having a low dielectric constant, a low firing temperature, and a low coefficient of thermal expansion is provided from a mixture of 0-30 wt. % alumina, 30-60 wt. % fused silica, and 30-70 wt. % of a glass comprised of PbO, B2O3, and SiO2. The mixture has a minimum sintering temperature in the range of 800 DEG -900 DEG C., and can be formed by conventional manufacturing techniques. It is particularly useful for the fabrication of single or multilayer electronic circuit substrates.
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