发明名称 CONNECTION STRUCTURE BETWEEN CIRCUIT SUBSTRATES
摘要 PURPOSE:To make it possible to connect with high reliability two circuit substrates with an anisotropic conductive sheet by attaching projected members to the outside of an external connection electrode at the outer end of one substrate. CONSTITUTION:Face-to-face projected members 4a and 4b are attached to the outside of an external connection electrode 2a at the outer end of a circuit substrate 1a. The members 4a and 4b are preferably made of the same material as the electrodes 2a and 2b or substrates 1a and 1b. That is, a material which can be fixed on the substrates 1a and 1b and withstands a temperature for thermocompression bonding of an anisotropic conductive sheet 3 is acceptable. The members 4a and 4b generate the maximum shearing stress therein and suppress shearing stress in the electrodes 2a and 2b. Therefore, the substrates 1a and 1b are connected with high reliability with the sheet 3.
申请公布号 JPH03265186(A) 申请公布日期 1991.11.26
申请号 JP19900062678 申请日期 1990.03.15
申请人 HITACHI LTD 发明人 MUTO MASAAKI;YOSHIDA TORU;NAKAMURA SHOZO
分类号 H05K1/14;H01R12/04;H05K1/11;H05K3/32;H05K3/36 主分类号 H05K1/14
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