HEAT SINK PLATE FOR SEMICONDUCTOR ELEMENT,申请号JP19900060921-传众专利搜索

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发明名称	HEAT SINK PLATE FOR SEMICONDUCTOR ELEMENT
摘要
申请公布号	JPH03263860(A)	申请公布日期	1991.11.25
申请号	JP19900060921	申请日期	1990.03.14
申请人	FUJITSU LTD	发明人	OIKAWA YOICHI;MORI KAZUYUKI
分类号	H05K7/20;H01L23/42	主分类号	H05K7/20
代理机构		代理人
主权项
地址

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